| PART |
Description |
Maker |
| TREK-723R-A0E TREK-722R-HBCEA0E TREK-722R-CBCEA0E |
RISC All-in-One Mobile Data Terminal
|
Advantech Co., Ltd.
|
| 2725N-18 |
For notebook PC, mobile information terminal, and PC card
|
NIHON DEMPA KOGYO
|
| HYB18M512160BF-6 HYB18M512160BF-7.5 HYE18M512160BF |
DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM RoHS compliant
|
Qimonda AG
|
| DVS-355-ZU25E DVS-355-MU25E DVS-355-SU25E DVS-355M |
Embedded/Mobile Digital Video Platform with Intel Core Duo Mobile Processor
|
Advantech Co., Ltd.
|
| STN8810BDS12HPBE STN8810S12 |
STn8810 mobile multimedia application processor with 1-Gbit NAND-Flash and 512-Mbit DDR mobile RAM
|
STMicroelectronics
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| HYC9068 |
Local Area Network Driver LAND
|
Standard Microsystems
|
| CX11250 CX20463 SMARTHSF CX20437 |
Smart HSF mobile modem
SmartHSF Mobile Modem
Host-Processed, V.90/K56flex Modem Device Set with CX11250 Host Side Device, CX20463 SmartDAA, and Optional CX20437 Voice Codec for PCI Bus/Mini PCI-Based Mobile Applications
|
List of Unclassifed Manufacturers
Conexant
Electronic Theatre Controls, Inc.
|
| LPF7032T-3R3M LPF7032T-100M LPF7032T-101M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| 90-0096 |
PACKAGE LAND PATTERN, (S8) 0.150 SOIC, 8 LEADS
|
Maxim Integrated Products
|
| LPF3510T-6R8M LPF3510T-470M LPF3510T-2R2M LPF3510T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
